Google’s earlier Tensor chipsets powering the corporate’s Pixel lineup of smartphones and, only in the near past, a pill, are, in a technique or one other, based mostly on Samsung’s earlier Exynos SoC launches. The Tensor G3’s distinctive 9-core CPU cluster was probably based mostly on the Korean big’s unreleased Exynos 2300, so it will be utterly superb to imagine that the upcoming Tensor G4 would have some relation with the Exynos 2400. Sadly, the specification variations don’t give us confidence on this declare, despite the fact that one tipster believes it.
Tipster realizes his error along with his declare; makes an up to date assertion that the Tensor G4 might be based mostly on Google’s and ARM’s design
For those who have no idea, Samsung’s Exynos 2400 encompasses a 10-core CPU cluster, whereas a Geekbench 5 leak revealed that the Tensor G4 is an 8-core CPU half, with its general configuration sporting one much less core than what the Tensor G3 was touting. Regardless, @OreXda believes that Google’s upcoming SoC designed for the Pixel 9 and Pixel 9 Professional relies on the Exynos 2400 and shares a number of specs too, however in all probability failed to note the variations between every silicon.
Even the GPUs of the Tensor G4 and Exynos 2400 are fully totally different, with the latter that includes an Xclipse 940 graphics processor that’s based mostly on AMD’s RDNA3 structure, whereas the Tensor is proven to accommodate ARM’s Immortalis-G715, which stays unchanged from the Tensor G3. Fortunately, the tipster realized the error of his claims and responded on the thread that the Tensor G4 may very well be a semi-custom SoC, with Google benefiting from ARM’s current CPU and GPU designs.
Tensor G4 : Primarily based on Exynos 2400#CPU
– 1 x Cortex-X4 @ 3.1 GHz
– 3 x Cortex-A720 @ 2.6GHz
– 4 x Cortex-A520 @ 1.95GHz#GPU
– Mali-G715 pic.twitter.com/Vq9ukL5reD— Connor / 코너 / コナー (@OreXda) February 9, 2024
What @OreXda could have meant when he mentioned that the Tensor G4 relies on the Exynos 2400 is that it makes use of varied fabrication and packaging applied sciences that Samsung launched this yr. This contains the extra environment friendly 4LPP+ course of, together with ‘Fan-out Wafer Degree Packaging’ (FOWLP), which lowers warmth resistance, permitting a smartphone silicon to take care of its temperatures and procure excessive multi-core scores. We additionally reported earlier that the Tensor G4 can be a minor improve over its predecessor.
Which means that till Google switches its foundry associate to TSMC, which isn’t slated to occur till the arrival of the Tensor G5 in 2025, we should always not count on the Pixel 9 or Pixel 9 Professional to pose any significant menace to the competitors in uncooked efficiency. Google can sort out the market in different classes, comparable to on-device AI capabilities and a brand new digital camera array, however in single-threaded and multi-threaded workloads, Google may be behind the pack as soon as once more.
Information Supply: @OreXda
